Intel, the stalwart in semiconductor technology, is poised to revolutionize chipmaking with PowerVia. This groundbreaking approach represents a radical departure from traditional chip fabrication methods, promising significant improvements in performance and efficiency.
Conventionally, computer chips are assembled in layers, starting with the smallest components—transistors. Layers of increasingly larger wires, or interconnects, are then added to connect these transistors and different chip elements. Power connections are made through these top layers, which are essential for chip functionality.
However, as chips have become smaller and denser, the web of interconnects and power connections in these top layers has grown chaotic, leading to diminished chip performance. Power and signal degradation has become a major concern, necessitating cumbersome workarounds or increased power consumption.
Intel recognized these issues and embarked on a decade-long journey to find a solution. The answer lies in “backside power,” a concept that involves moving power connections to the backside of the chip, leaving the front side dedicated exclusively to interconnections.
This innovative approach, known as PowerVia, allows for a more direct and efficient power delivery path, eliminating the need for complex top-layer interconnects. The wires for power, which can occupy up to 20% of the front-side real estate, are removed, enabling relaxed interconnect layers and simplifying manufacturing. Astonishingly, this two-part flip-over process turns out to be more cost-effective than the traditional method.
The benefits are far-reaching. PowerVia enhances chip performance by improving power delivery and signal wiring, leading to more efficient speeds. This advancement aligns with Moore’s Law, promising faster work with less power consumption.
Intel’s test chip, Blue Sky Creek, based on the forthcoming Meteor Lake processor, demonstrates impressive results. It exhibits over a 5% frequency boost and over 90% cell density improvement compared to previous generations.
Moreover, PowerVia challenges traditional chip-testing techniques, which relied on the accessibility of transistors in the first layer. With transistors now sandwiched within the chip, new debugging methods were required. Intel’s teams, through a decade of research and development, successfully overcame these hurdles.
PowerVia is set to debut in Intel-manufactured silicon with the 20A node in 2024, positioning Intel as a leader in backside power technology. Competitors are expected to lag by approximately two years.
This groundbreaking innovation will be embodied in the Arrow Lake processor, arriving in 2024. With billions of transistors working more efficiently, Intel’s PowerVia promises to reshape the future of chipmaking, delivering unprecedented performance and efficiency to consumers and industries alike.
